L&T Semiconductor Technologies Joins imec's Automotive Chiplet Initiative

Mumbai — L&T Semiconductor Technologies Ltd (LTSCT), the semiconductor arm of engineering conglomerate Larsen & Toubro, has joined imec's Automotive Chiplet Program (ACP), a pre-competitive research initiative bringing together participants across the automotive value chain globally.

The program investigates chiplet architectures and cutting-edge packaging methods designed to satisfy the exacting demands of automakers — encompassing performance, functional safety, dependability and product lifespan — while delivering the adaptability, scalability and economic advantages inherent to chiplet systems.

Automotive manufacturers have long depended on semiconductor technology for vehicle electronics. Yet the traditional monolithic system-on-chip approach faces mounting pressure from the computational and data transfer requirements of advanced driver-assistance systems (ADAS), software-defined vehicles (SDVs) and contemporary in-vehicle infotainment (IVI) systems. Chiplets — discrete silicon modules engineered for particular functions and linked through sophisticated 2.5D and 3D packaging — present an alternative model providing superior performance efficiency, shortened development cycles and stronger supply-chain resilience.

"Chiplets signify a transformational shift in delivering performance and integration capabilities for automotive applications," stated Sandeep Kumar, Chief Executive of LTSCT. "As vehicle platforms increasingly adopt software-defined, modular and scalable architectures, hardware flexibility becomes essential."

He elaborated: "Collaborating with imec and fellow ACP members, LTSCT seeks to shape the technical standards and reference frameworks guiding the evolution of sophisticated, power-efficient automotive platforms. Our contribution will focus on safety-critical processing functions, efficient chip-to-chip communication pathways and comprehensive verification and diagnostic systems spanning manufacturing through operational deployment. We will bring real-world expertise from commercialisation efforts — encompassing certification, troubleshooting and asset management across actual automotive settings."

Bart Placklé, Vice President of Automotive Technologies at imec, welcomed the addition: "We are pleased to include LTSCT — India's leading semiconductor product manufacturer — in the Automotive Chiplet Program. Moving toward chiplet-based designs becomes economically unfeasible when pursued independently by vehicle makers. Market success hinges on industry-wide standardisation of interoperable chiplet specifications enabling automakers to incorporate both licensed and proprietary chiplets into customised solutions. The chiplet architecture eliminates single-vendor dependency, strengthens supply-chain adaptability and optimises power consumption and physical footprint — all vital for creating more efficient and environmentally conscious vehicle designs."

The Automotive Chiplet Program draws on imec's established capabilities in sophisticated 2.5D and 3D packaging technologies and its extensive network encompassing semiconductor manufacturers and automotive stakeholders.

Through its participation in the imec initiative, LTSCT underscores its dedication to strengthening India's standing in the international semiconductor landscape. By contributing to universal chiplet specifications and engaging with prominent figures in automotive and technology sectors, LTSCT aims to facilitate the development of safer, more intelligent and environmentally sustainable vehicles on a global scale.